1. Diamond is well-distributed and packaged; sharpness is good and efficiency is high. 2. Lost of kerf is low with high capacity....
1. Diamond is well- packaged; sharpness is good. 2. Cutting speed is fast, capacity is high with low cost. 3. Advanced and stable...
1. Diamond is well-distributed and packaged. 2. Substrate cutting for LED sapphire is efficient and fast. 3. Quality is stable wi...
1. Diamond is well-distributed and packaged; sharpness is good and efficiency is high. 2. Lost of kerf is low with high capacity....
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...
Wire saw of resin diamond is cost effective and of large scale production and high efficiency. Widely used in IC cutting, engineering ceramic a...