Position:Home > Products > Diamond wire saw > Micrometer wire of diamond 310-350 (silicon wafer cutting and root)
  • Business areas
  • +86-371-63379559
  • info@sinocrystal.com.cn
  • Building 30#, No. 20 Bitao Road, High and New Technology Development Zone, Zhengzhou
 

Micrometer wire of diamond 310-350 (silicon wafer cutting and root)

date：2015-06-23 13:25  hits：  size【big | normal | small】

1. Diamond is well- packaged; sharpness is good.
2. Cutting speed is fast, capacity is high with low cost.
3. Advanced and stable technique with high precision of cutting.
4. Low cost of operation.